---
title: "Board and fab"
url: "https://nearfieldnotes.com/families/fab/"
site: "Near Field Notes"
---

# Board and fab

Notes for when a joint won’t solder.

## Notes

- [Thermal relief](https://nearfieldnotes.com/notes/thermal-relief/): Should a ground pin tie into the plane through a thermal relief? Yes, if it gets soldered. On a 4-layer board with the fab’s default copper, a 402 °C iron melts the solder on the far side through KiCad’s default spokes in 3 s. Tied in solid, it needs 536 °C. A Hakko FX-888D tops out at 480 °C.

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Source: https://nearfieldnotes.com/families/fab/